PI Unfilled

PI Unfilled

PI Unfilled Overview

What is the Material: PI Unfilled is an amorphous imidized material.

Key Material Features: This material is beneficial in applications requiring extreme temperature resistance, diverse chemical resistance, strength, and dimensional stability.

Other Considerations: This material is attacked by hot water/steam.

Physical

Property Value Typical ASTM Test
Chemical Designation (PI) Polyimide
Trade Names (®, ™) Tecasint 2011, Duratron D7000
Color Brown
Density (g/cm^3) 1.38 D 792

Mechanical

Property Value Typical ASTM Test
Modulus of Elasticity (Tensile Test) (psi) 681500 D 638
Tensile Strength at Yield (psi) 17110 D 638
Elongation at Break (%) 4.4 D 638
Flexural Strength (psi) 25700 D 790
Modulus of Elasticity (Flexural Test) (psi) 522000 D 790
Compression Strength: 10% Strain (psi) 27000 D 695
Compression Modulus (psi) 336000 D 695
Impact Strength (Izod) (ft-lbs/in) 1.0 D 256
Hardness (R) 128 D 785
Hardness (D) 90 D 785
Coefficient of Friction (Kinetic, 40 psi, 50 fpm) 0.29 D 3702
Wear (K) Factor (in^3-min/ft-lbs-hr) (Against Steel, 40 psi, 50 fpm) 1.50E-8 D 3702

Thermal

Property Value Typical ASTM Test
Deflection Temperature (°F) (264 psi) 600 D 648
Service Temperature Continuous (°F) 536
Service Temperature Intermittent (°F) 626
Thermal Expansion (CLTE) (in/in/°F) 3.00E-5 D 696
Thermal Conductivity (BTU-in/hr-ft^2-°F) 1.53
Specific Heat (BTU/lb-°F) 0.221

Electrical

Property Value Typical ASTM Test
Specific Surface Resistance (Ω/square) 5.00E15 D 257
Volume Resistivity (Ω*cm) 8.00E15 D 257
Dielectric Strength (V/mil) 554 D 149
Dissipation Factor (60 Hz) 0.003 D 150
Dielectric Constant (1MHz) 4.2 D 150

Other

Property Value Typical ASTM Test
Moisture Absorption (%) (24 Hours) 0.24 D 570
Flammability V-0
The data stated are typical values intended for reference and comparison purposes only. The data should not be used as a basis for design specifications or quality control. The information is provided as a guide to the best of our knowledge and given without obligation or liability. Testing under individual application circumstances is recommended.