PAI Carbon 30%

Overview

What is the Material: PAI 30% Carbon is an imidized amorphous material filled with carbon fibers.

Key Material Features: This material is beneficial in applications requiring reinforced structural properties, while maintaining the properties of other PAI materials including high strength, dimensional stability, diverse chemical resistance, and it maintains its properties at elevated temperatures.

Other Considerations: This material is attacked by hot water and steam. The carbon filler reinforces the structural properties, but it is not abrasive like glass filled can be.

Physical

Property Value Typical ASTM Test
Chemical Designation (PAI) Polyamide-imide
Trade Names (®, ™) Torlon, Tecapai CM XP730, Duratron T7130
Filler 30% Carbon Filled
Color Black
Density (g/cm^3) 1.47 D 792

Mechanical

Property Value Typical ASTM Test
Modulus of Elasticity (Tensile Test) (psi) 1200000 D 638
Tensile Strength at Yield (psi) 12500 D 638
Tensile Strength at Break (psi) 24000 D 638
Elongation at Break (%) 4 D 638
Flexural Strength (psi) 37000 D 790
Modulus of Elasticity (Flexural Test) (psi) 1300000 D 790
Compression Strength: 10% Strain (psi) 40000 D 695
Compression Strength: 1% Strain (psi) 6500 D 695
Compression Modulus (psi) 700000 D 695
Impact Strength (Izod) (ft-lbs/in) 1.1 D 256
Hardness (D) 94 D 785
Hardness (E) 90
Coefficient of Friction (Kinetic, 40 psi, 50 fpm) 0.15 D 3702
Coefficient of Friction (Static) 0.13 D 3702
Wear (K) Factor (in^3-min/ft-lbs-hr) (Against Steel, 40 psi, 50 fpm) 7.50E-9 D 3702

Thermal

Property Value Typical ASTM Test
Glass Transistion Temperature (°F) 529 D 3418
Deflection Temperature (°F) (264 psi) 526 D 648
Service Temperature Continuous (°F) 500
Thermal Expansion (CLTE) (in/in/°F) 1.62E-5 D 696
Thermal Conductivity (BTU-in/hr-ft^2-°F) 3.60

Other

Property Value Typical ASTM Test
Moisture Absorption (%) (24 Hours) 0.3 D 570
Moisture Absorption (%) (Saturated) 1.5 D 570
Flammability V-0
The data stated are typical values intended for reference and comparison purposes only. The data should not be used as a basis for design specifications or quality control. The information is provided as a guide to the best of our knowledge and given without obligation or liability. Testing under individual application circumstances is recommended.